Vacuum solder reflow device / oxide film reduction device 'RSS-210-S'
Formic acid and hydrogen reduction compatible! Desktop type that can accommodate substrates up to 200mm x 200mm.
This is a tabletop vacuum solder reflow device compatible with both formic acid and hydrogen reduction. Despite its compact size, which is among the smallest in the industry, it supports atmospheric, nitrogen, and reducing atmospheres (formic acid or hydrogen), as well as vacuum reflow. Additionally, it features rapid heating and cooling through a water cooling system, making it suitable for research and development or prototyping. It flexibly accommodates various applications, including solder reflow, reduction treatment of metal oxide films, and sintering of paste materials. **Features** - Achieves zero flux residue by removing oxide films without using flux. - Reaches a maximum temperature of 400°C despite its tabletop size. - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow. - Supports rapid cooling through a water cooling system. - The working area is gas shielded, allowing for use in processes sensitive to contamination and other critical processes. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：ユニテンプジャパン
- Price：10 million yen-50 million yen
